Advanced Semiconductor Packaging & Chiplet Show 2026

Overview

■ Semiconductor packaging test and process equipment ■ Semiconductor packaging materials and components ■ Semiconductor packaging technology solutions and design software (EDA) ■ Semiconductor glass substrates ■ System semiconductors ■ Other wafer processing materials, components, equipment, etc.

Organizer & contact

Organizer

경기도, 수원시 GYEONGGI-DO, SUWON CITY

Host

(주)제이엑스포, (재)수원컨벤션센터, (주)전자신문사

Sponsor

소부장기술융합포럼, 차세대융합기술연구원, 한국나노기술원, 한국마이크로전자및패키징학회, 한국반도체산업협회, 한국실장산업협회, 한국전자기술연구원, 한양대학교링크3.0사업단, 한양첨단패키징연구센터

Phone

0262859131

Email

jaeho.lee@jexpo.or.kr

Website

https://www.semipkgshow.com/

Location